Lab brick and production ceiling
Two envelopes. The resin shell wraps the kit we can buy today. The product is Thor inside a camera body, on the T4000 SOM, unless the stream budget forces the bigger module.
Lab — AGX Developer Kit
T5000 module in NVIDIA’s brick. First enclosure, first software bring-up.
- 243.19 × 112.40 × 56.88 mm
- 128 GB, 2× NVENC, 40–130 W
- 1× 5GbE RJ45, 1× QSFP28 (4 independent 25G, not 100G aggregated)
- USB-C, HSB, HDMI out — no HDMI/SDI in
- HQ encode can do the 1+2 4K30 trio on-module
Production — T4000 SOM
DS-11945-001 v1.4. Smaller, cooler, one encoder. The default ceiling.
- 87.0 × 100.0 × 15.29 mm, 0.350 kg
- 64 GB LPDDR5X, 273 GB/s, 12× Neoverse V3AE, 1536 CUDA
- 1× NVENC / 1× NVDEC / 1 ISP
- 3× 25G MGBE, 75 Gbps total, independent
- Default 70 W, throttle 90 W, TTP max 75 °C. No CAN, no 3.3 V SV
- HQ encode: 2× 4Kp30. Hybrid fabric required for 1 body + 2 sats
Heat
TDG-12271-001 v1.3 is in the tree. The cooler is ours: it bonds to the TTP (62.5 × 81.4 mm). T4000 TTP max 75 °C. At 70 W balanced, SoC sits 16.8 °C above TTP — so TTP must stay ≤ 73.2 °C to hold SoC at 90 °C.
- 25 °C ambient, 70 W: cooler needs θpa ≤ 0.69 °C/W
- 45 °C (NVIDIA air-cooled ceiling): θpa ≤ 0.40 °C/W
- ATS “passive” 100 W is 500 LFM chassis air, not still air. Natural convection on that brick is ~140 °C rise at 70 W.
- Cine shell still air: ~38–50 W. Body-as-radiator is honest at ~40 W.
- 70 W AI: heatpipes to a rear radiator + one large slow fan. Not a flock of blowers.
- Record-only (drop AI): 15–30 W, fanless-capable.
Thor-in-body stays the product shape. Metal CAD waits on a T4000 + Rogue-T5 + ATS measurement. Thermal extract · TDG PDF
Plant (bring-up)
[body cam] --CSI/GMSL--> Thor ISP --> NVENC H.265 --> NVMe ring --> 5/10/25GbE --> NAS
[body /i ] --PL pins or barrel--> UART/USB on Thor ----------------+--> JSONL sidecar
[sat 1] --PoE H.265--> PoE switch --\ |
[sat 2] --PoE H.265--> PoE switch ---+--> Thor remux / NVDEC ----+--> NAS
PoE switch is a kit item (Thor has no PoE)